"12th Five-Year" period, China mold industry will further adjust the structure, expand the market, hard skills, to enhance the level of the China mold industry to a new level in the whole, and this is not just a mold industry "". The development of mold industry and other industries can be used to describe the development and be closely related and mutually dependent, the overall level of mold industry promotion and related industries are closely related.
At present, China's mold products are mainly based on medium and low, the technical content is relatively low, the majority of high and medium mold to rely on imports, one of the reasons is that the lack of core technology related industries. As in the field of IC packaging mold, due to the overall level of the domestic IC industry as well as the reasons for foreign technology blockade, making IC packaging mold industry is difficult to develop at a high starting point. Thus, in the IT industry, the automotive industry to promote the growth of mold products demand at the same time, enhance China's IT industry, the overall strength of the automotive industry is an indispensable win-win.

1, semiconductor packaging mould to automation
Requirements of semiconductor packaging mould industry of mold is: one is the requirement of finishing mould, current electronic products continue to miniaturization and integration of products, high-end trend, size is smaller, thinner package, this package of increasingly high demand, high precision molds.
The mold technology is one of the extremely important means of production process in semiconductor devices, the general application of single cylinder packaging technology, the package includes DIP, SOP, object QFP, SOT, SOD, TR and discrete device chip tantalum capacitor, inductor, bridge circuit and other products.
Packaging technology is evolving these days. The chip size is reduced, the chip area and the package area ratio are more and more close to 1, the I/O number increases, the pin spacing reduces. The development of packaging technology cannot do without the electronic tooling equipment advanced, multi injection head package (MGP), automatic punching die cutting and forming of new high-tech products system, automatic packaging system to meet this demand, Jia also launched these products.
Multi injection head packaging die (MGP) is an extension of single cylinder mold technology, and is now the mainstream product of packaging die. The utility model has the advantages of multi material barrel and multi injection head package, and the advantage of the utility model is that the utility model has the advantages of balanced flow passage, close filling, high resin utilization rate, stable package process and good product packaging quality. It is suitable for SSOP, TSSOP, LQFP and other multi row, bar spacing, high-density integrated circuit, and SOT, SOD and other micro semiconductor device product packaging.
Automatic punching and cutting forming system is an automatic equipment formed by integrated circuit and semiconductor device. High speed, multi-function, versatility, is the development direction of the system, can meet all kinds of lead frame carrier product molding.
In the future, the development trend of semiconductor packaging die is to develop more accurate and more high-speed packaging die - automatic packaging mold development. Automatic plastic sealing system is the high precision and high automation equipment of IC after process. Set up a number of plastic working unit system, installation mode MGP mode cassette in each unit, a plurality of unit package according to the sequence of preparation, the set piece, feeding, filling, packaging, mold cleaning, removing glue, receiving in one. The development of this technology is relatively fast in foreign countries. There have been such technologies as film coating, encapsulation, glue dispensing and plastic sealing, which can meet the needs of packaging of various high density and high lead products.
With the rapid development of micro electronics technology, the application technology of plastic packaging equipment in the post process of semiconductor has been improved continuously, and the automation operation has become an inevitable trend. As the first domestic Sanjia mould industry listed companies, will focus on advanced technology in the world, the development of electronic mold localization process.

2,
Connector terminal in the mold, the domestic manufacturers dominated by low-end, mainly for high-end guosheng. The current international connector manufacturers such as Guosheng amp AMP, MOLEX and other well-known manufacturers.
Connector on mould manufacturing industry is demanding: one is the need to have a high level of mold design, because the terminals of different shapes, connectors have different structures, it is important to rationally design, if unreasonable structure will lead to unqualified products. Two is the high-precision equipment, connector terminals require processing equipment, high precision, foreign equipment accuracy can reach + 0.002mm, and the general domestic equipment can only reach + 0.01mm. Three is a good basic processing technology. A good connector mold needs the perfect combination of three aspects of design, equipment and process. At the same time, the supporting equipment requires high technical barriers is relatively high, using advanced CNC plane Guosheng mill, automatic optical curve grinding, wire cutting, machining center and other equipment combination, production.
The requirement of connector terminal mold is higher and higher, which is the trend of miniaturization of connector interface and high data transmission rate. Therefore, the mold equipment, materials, quality and other requirements higher, the mold punch punch speed has reached 500 rpm / -3000 RPM / cent, which put forward higher requirements for mold enterprises.
Luo Baihui pointed out that China's IT mold enterprises should continue to invest in equipment, investment funds for the purchase of the most advanced equipment, in order to introduce the highest level of technology, technology, and then research innovation. At present, the connector mold required wire cutting, 4 axis processing equipment manufacturers in China have been made, although the accuracy and stability there is still a gap, but this is a good beginning. In addition, the mold enterprises should carry out personnel training, to "go out, please come in" approach, and constantly improve the technical level of mold.
In addition, the small household appliance market, agricultural machinery, food machinery, construction hardware industry will drive home air conditioning radiator mould, motor mould, electron gun mold, sheet metal die industry rapid development, consistent with the advanced level in the world.

3, standard equipment, the development of better
Although China's mold industry has made considerable progress, and has made great progress, but in the upper and lower reaches of the mold industry supporting parts, processing equipment are mostly dependent on imports, and machine tools is a weak link. According to Luo Baihui, 2004 imports of processing equipment in the machine about $6 billion, and the application of machine tool mould industry accounted for most, this is also reflected in this field in China to refuel. Deputy Secretary General of Chinese mold industry association Qin Ke believes that domestic manufacturers should pay attention to the equipment manufacturing industry to the mold industry demand, domestic equipment manufacturers such as Shenyang machine tool group company has realized the mold machine "value added" potential, focus on R & D and production and processing center, CNC machine tools and other equipment. But the machine tool faces the high-speed, the precise, the high performance, the specialized, the systematization, the compound direction development, also brings the new topic for the domestic manufacturer.
In the field of standard parts of mould, there are more standard die parts in China, mainly mould bases, guide parts, punches and so on. The oil guide plate and wedge are used in automobile moulds. According to Luo Baihui, the China mold standard parts in the mold in the coverage rate of only 40%, while in Europe and the United States reached 70%. Luo Baihui pointed out that standardization has become a new trend in the development of the mold industry, mold industry should expand the variety of mold standard parts, improve its accuracy, improve production concentration, and achieve large-scale production.